SemiconductorX – The Chip Supply Chain, from Quartz to Module

SemiconductorX maps the semiconductor supply chain from quartz and refined materials through wafer production, chip design, fabrication, packaging, testing and finished modules. Its central concern is where each stage happens, which companies and facilities control it, and how much production is based in the United States. The site describes chipmaking as a global process spanning more than a dozen stages and countries; inside a fab, a wafer cycles through cleaning, deposition, patterning, etching and measurement 80 to 120 times before testing and assembly. It also explains how advanced packaging combines logic dies, high-bandwidth memory, interposers and substrates into systems such as AI accelerators.

A late-2026 supply-chain overview classifies 12 stages by US production: three are made domestically at scale, four have some US volume, three are planned, and two are made abroad. Examples of constraints include China’s near-total share of primary gallium, Japan’s role in ABF substrate film, ASML’s dominance in EUV lithography, and dependence on overseas suppliers for chip testers. The site connects these bottlenecks to US reshoring projects, policy, workforce needs and business models, while covering chip types, fab utilities, sectors and company supply chains. Its dataset contains 158 selected fabs and packaging plants across 17 countries - not a census or measure of global capacity - with 51 in the United States, 32 in China and 20 in Taiwan.